JPH0543311B2 - - Google Patents
Info
- Publication number
- JPH0543311B2 JPH0543311B2 JP62246892A JP24689287A JPH0543311B2 JP H0543311 B2 JPH0543311 B2 JP H0543311B2 JP 62246892 A JP62246892 A JP 62246892A JP 24689287 A JP24689287 A JP 24689287A JP H0543311 B2 JPH0543311 B2 JP H0543311B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- conductive
- conductive circuit
- hole
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24689287A JPS6489586A (en) | 1987-09-30 | 1987-09-30 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24689287A JPS6489586A (en) | 1987-09-30 | 1987-09-30 | Printed board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6489586A JPS6489586A (en) | 1989-04-04 |
JPH0543311B2 true JPH0543311B2 (en]) | 1993-07-01 |
Family
ID=17155293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24689287A Granted JPS6489586A (en) | 1987-09-30 | 1987-09-30 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6489586A (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6252176B1 (en) | 1996-04-19 | 2001-06-26 | Fuji Xerox Co., Ltd. | Printed wiring board, and manufacture thereof |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0357285U (en]) * | 1989-08-03 | 1991-05-31 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5593287A (en) * | 1979-01-08 | 1980-07-15 | Hitachi Ltd | Method of fabricating printed circuit board |
JPS59232495A (ja) * | 1983-06-15 | 1984-12-27 | 松下電工株式会社 | 多層配線基板の製造方法 |
-
1987
- 1987-09-30 JP JP24689287A patent/JPS6489586A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6252176B1 (en) | 1996-04-19 | 2001-06-26 | Fuji Xerox Co., Ltd. | Printed wiring board, and manufacture thereof |
Also Published As
Publication number | Publication date |
---|---|
JPS6489586A (en) | 1989-04-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR0142178B1 (ko) | 전장부품접합방법 및 모듈 및 다층기판 | |
EP0272707A2 (en) | Flexible printed circuit board terminal structure | |
JP3059568B2 (ja) | 多層プリント回路基板の製造方法 | |
US5079065A (en) | Printed-circuit substrate and method of making thereof | |
JP4992310B2 (ja) | 積層基板の製造方法 | |
WO2003005789A1 (fr) | Procede de production d'une carte de circuit imprime multicouche | |
JPH1093242A (ja) | 印刷配線基板 | |
JPH10200258A (ja) | 多層プリント配線板の製造方法 | |
JP3167840B2 (ja) | 印刷配線板および印刷配線板の製造方法 | |
JPH0543311B2 (en]) | ||
JPH1070363A (ja) | 印刷配線板の製造方法 | |
JPH06252555A (ja) | 多層配線基板 | |
JP3236829B2 (ja) | バイアホール部の接続構造及び配線基板 | |
JP3780535B2 (ja) | プリント配線板の製造方法 | |
JP2002246745A (ja) | 三次元実装パッケージ及びその製造方法、三次元実装パッケージ製造用接着材 | |
JP4566573B2 (ja) | 部品実装構造および部品実装方法 | |
JPS5823956B2 (ja) | インサツハイセンバン | |
CN214800010U (zh) | 电路板以及电子设备 | |
JP3250390B2 (ja) | 多層プリント配線板 | |
JP2003273518A (ja) | 多層回路基板及びその製造方法 | |
JPS62222604A (ja) | 回路板の形成方法 | |
JP2865241B2 (ja) | 電子部品の接続方法 | |
JP2004031814A (ja) | 配線基板およびそれを用いた電子装置 | |
JPH09283931A (ja) | 多層配線基板 | |
JP2003273517A (ja) | 多層回路基板及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |